Thank you for your interest in L 3 Communications Corporation part number 7186674 002, a Shielding Bead Electronic item that we offer here on Aerospace Materials Supply. This product is listed with the NSN 5950-01-578-9923, and you can obtain customized procurement solutions on this component from our team members by completing and submitting the form below. For our specialists to best deliver quotes that accommodate your specifications, please be sure we are presented with essential details like your target price, desired quantity, and anticipated fulfillment timeline. Once we have the opportunity to receive and review your submission, we will strive to provide a tailored response for your consideration within 15 minutes or less.
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Besides part number 7186674 002, you may browse our platform further for similar components produced by L 3 Communications Corporation under the CAGECode 06401, as well as additional products that are categorized under FSC 5950 Coils and Transformers. If you have any questions regarding our services or the NSN 5950-01-578-9923 items that we sell, you may always give us a call or email, as we would be delighted to assist you in any way that we can. Otherwise, we encourage you to request a quote for part number 7186674 002 at your earliest convenience.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5950-01-578-9923 Item PartTypeName: SHIELDING BEAD,ELECTRONIC | 5950 | 015789923 | 0 | P | A | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | A | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
7186674-002 | 5 | 2 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
MRC | Decoded Requirement | Clear Text Reply |
FEAT | Special Features | CHIP BEAD (IMPEDER), MMZ SERIES OFFERS 4 CONSTRUCTION MATERIALS; SIZE STANDARIZED FOR USE BY AUTOMATIC ASSEMBLY EQUIPMENT; NO PREFERRED ORIENTATION; EITHER FLOW OR REFLOW SOLDERING METHODS CAN BE USED DUE TO ELECTROPLATING OF THE TERMINAL ELECTRODES; HIGH RELIABILITY DUE TO AN ENTIRELY MONOLITHIC STRUCTURE; CLOSED MAGNETIC CIRCUIT STRUCTURE ALLOWS HIGH-DENSITY INSTALLATION WHILE PREVENTING CROSSTALK BETWEEN CIRCUITS; LOW DC RESISTANCE STRUCTURE OF ELECTRODE PREVENTS WASTEFUL ELECTRIC POWER CONSUMPTION; CONTAINS NO LEAD AND ALSO SUPPORT LEAD-FREE SOLDERING; CONFORMING TO ROHS DIRECTIVE |
CXCY | Part Name Assigned By Controlling Agency | CHIP BEADS(SMD) FOR SIGNAL LINE |
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