Thank you for your interest in Litton Systems Inc part number 839201-0028, a Microcircuitmemory item that we offer here on Aerospace Materials Supply. This product is listed with the NSN 5962-01-113-7050, and you can obtain customized procurement solutions on this component from our team members by completing and submitting the form below. For our specialists to best deliver quotes that accommodate your specifications, please be sure we are presented with essential details like your target price, desired quantity, and anticipated fulfillment timeline. Once we have the opportunity to receive and review your submission, we will strive to provide a tailored response for your consideration within 15 minutes or less.
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Besides part number 839201-0028, you may browse our platform further for similar components produced by Litton Systems Inc under the CAGECode 13973, as well as additional products that are categorized under FSC 5962 Microcircuits Electronic. If you have any questions regarding our services or the NSN 5962-01-113-7050 items that we sell, you may always give us a call or email, as we would be delighted to assist you in any way that we can. Otherwise, we encourage you to request a quote for part number 839201-0028 at your earliest convenience.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-113-7050 Item Description: MICROCIRCUIT,MEMORY | 5962 | 011137050 | N | |||
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
839201-0028 | 3 | 9 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
CZEQ | Time Rating Per Chacteristic | 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
CQZP | Input Circuit Pattern | 18 INPUT |
TEST | Test Data Document | 13973-839201-0018 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
CQSJ | Inclosure Material | CERAMIC |
MRC | Decoded Requirement | Clear Text Reply |
TTQY | Terminal Type And Quantity | 24 PRINTED CIRCUIT |
ADAT | Body Width | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
CBBL | Features Provided | HERMETICALLY SEALED AND MONOLITHIC AND 3-STATE OUTPUT AND PROGRAMMABLE AND PROGRAMMED |
CWSG | Terminal Surface Treatment | SOLDER |
ADAQ | Body Length | 1.290 INCHES MAXIMUM |
AEHX | Maximum Power Dissipation Rating | 1.0 WATTS |
ADAU | Body Height | 0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM |
CTFT | Case Outline Source And Designator | D-3 MIL-M-38510 |
AFGA | Operating Temp Range | +0.0/+70.0 DEG CELSIUS |
CQSZ | Inclosure Configuration | DUAL-IN-LINE |
CZER | Memory Device Type | RAM |
CZEN | Voltage Rating And Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
CQWX | Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
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