Thank you for your interest in Sgs Thompson Microelectronics Inc part number IMS1600S-70M, a Microcircuit Memory item that we offer here on Aerospace Materials Supply. This product is listed with the NSN 5962-01-245-3441, and you can obtain customized procurement solutions on this component from our team members by completing and submitting the form below. For our specialists to best deliver quotes that accommodate your specifications, please be sure we are presented with essential details like your target price, desired quantity, and anticipated fulfillment timeline. Once we have the opportunity to receive and review your submission, we will strive to provide a tailored response for your consideration within 15 minutes or less.
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Besides part number IMS1600S-70M, you may browse our platform further for similar components produced by Sgs Thompson Microelectronics Inc under the CAGECode 60911, as well as additional products that are categorized under FSC 5962 Microcircuits Electronic. If you have any questions regarding our services or the NSN 5962-01-245-3441 items that we sell, you may always give us a call or email, as we would be delighted to assist you in any way that we can. Otherwise, we encourage you to request a quote for part number IMS1600S-70M at your earliest convenience.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-245-3441 Item Description: Microcircuit Memory | 5962 | 012453441 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Ims1600s-70m | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CZEQ | Time Rating Per Chacteristic | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | Memory Device Type | RAM |
| AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
| CQZP | Input Circuit Pattern | 19 INPUT |
| CBBL | Features Provided | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND HIGH RELIABILITY AND W/ENABLE |
| CQSJ | Inclosure Material | CERAMIC |
| ADAT | Body Width | 0.310 INCHES MAXIMUM |
| TTQY | Terminal Type And Quantity | 22 PRINTED CIRCUIT |
| CWSG | Terminal Surface Treatment | SOLDER |
| ADAQ | Body Length | 1.111 INCHES MAXIMUM |
| AEHX | Maximum Power Dissipation Rating | 1.0 WATTS |
| ADAU | Body Height | 0.180 INCHES MAXIMUM |
| TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| MRC | Decoded Requirement | Clear Text Reply |
| CQSZ | Inclosure Configuration | DUAL-IN-LINE |
| AFGA | Operating Temp Range | -55.0/+125.0 DEG CELSIUS |
| CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEN | Voltage Rating And Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZZZ | Memory Capacity | UNKNOWN |
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